GBJ25005 Datasheet, PDF (1/2 Pages) Diodes Incorporated – 25A GLASS PASSIVATED BRIDGE RECTIFIER

Bridge Rectifier
GBJ25005 THRU GBJ2510
Formosa MS
■ Features
● I_o
25A
● V_RRM
50V~1000V
● 玻璃钝化芯片
Glass passivated chip
● 耐正向浪涌电流能力高
High surge forward current capability
■ Applications
● 作一般电源单相桥式整流用
General purpose 1 phase Bridge
rectifier applications
■ Outline Dimensions and Mark
HOLE FOR NO.
6 SCREW
GBJ
1.193(30.3)
1.169(29.7)
.189(4.8)
.173(4.4)
.150(3.8)
.134(3.4)
+
.106(2.7)
.096(2.3)
.094(2.4)
.078(2.0)
.043(1.1)
.035(0.9)
.800(20.3)
.776(19.7)
.441(11.2)
~
~
-
.228(5.8)
.189(4.8)
.425(10.8)
.165(4.2)
.150(3.8)
.153(3.9)
.134(3.4)
.708(18.0)
.669(17.0)
.134(3.4)
.122(3.1)
DIA
.402(10.2) .303(7.7) .303(7.7)
.386(9.8) .287(7.3) .287(7.3)
Dimensions in inches and (millimeters)
.031(0.8)
.023(0.6)
■Limiting Values（Absolute Maximum Rating）
参数名称
Item
反向重复峰值电压
Repetitive Peak Reverse
Voltage
平均整流输出电流
Average Rectified Output
Current
正向（不重复）浪涌电流
Surge(Non-
repetitive)Forward Current
正向浪涌电流的平方对电流
浪涌持续时间的积分值
Current Squared Time
存储温度
Storage Temperature
结温
Junction Temperature
绝缘耐压
Dielectric Strength
安装扭矩
Mounting Torque
符号 单位
Symbol Unit
条件
Conditions
V_RRM
I_O
I_FSM
I²t
V
60Hz正弦波，
用散热片 T_c =98℃
A
电阻负载
With heatsink T_c =98℃
60Hz sine wave, 无散热片 T_a =25℃
R-load
Without heatsink T_a =25℃
A
60H_Z正弦波，一个周期，T_j=25℃
60H_Z sine wave, 1 cycle, T_j=25℃
A²S
1ms≤t<8.3ms Tj=25℃，单个二极管
1ms≤t<8.3ms Tj=25℃，Rating of per diode
T_stg
℃
T_j
℃
V_dis
KV
Tor
kg·
cm
端子与外壳之间外加交流电，一分钟
Terminals to case，AC 1 minute
推荐值：5kg·cm
Recommend torque：5kg·cm
GBJ25
005 01 02 04 06 08 10
50 100 200 400 600 800 1000
25
3.5
350
508
-55 ~+150
-55 ~+150
2.5
8
■Electrical Characteristics（T =25℃ Unless otherwise specified）
a
参数名称
符号 单位
测试条件
Item
Symbol Unit
Test Condition
正向峰值电压
Peak Forward Voltage
反向峰值电流
Peak Reverse Current
热阻
Thermal Resistance
V_FM
V
I_RRM
μA
R_θJ-A
R_θJ-C
℃/W
I_FM=12.5A, 脉冲测试，单个二极管的额定值
I_FM=12.5A, Pulse measurement, Rating of per diode
V_RM=V_RRM ,脉冲测试，单个二极管的额定值
V_RM=V_RRM , Pulse measurement, Rating of per diode
结和环境之间，无散热片
Between junction and ambient, Without heatsink
结和管壳之间，用散热片
Between junction and case, With heatsink
最大值
Max
1.1
10
22
1.0
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Page 1
Document ID Issued Date
DS-242146 2009/08/10
Revised Date Revision
2010/03/10
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