FM220-M Datasheet, PDF (1/2 Pages) Formosa MS – Silicon epitaxial planer type

Chip Schottky Barrier Diodes
FM220-M THRU FM2100-M
Formosa MS
Silicon epitaxial planer type
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
Mechanical data
Case : Molded plastic, JEDEC SOD-123 / MINI SMA
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting Position : Any
Weight : 0.04 gram
SOD-123
0.161(4.1)
0.146(3.7)
0.012(0.3) Typ.
0.071(1.8)
0.055(1.4)
0.110(2.8)
0.094(2.4)
0.035(0.9) Typ.
0.063(1.6)
0.055(1.4)
0.035(0.9) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (AT T_A=25^oC unless otherwise noted)
PARAMETER
CONDITIONS
Symbol MIN.
Forward rectified current
See Fig.1
IO
Forward surge current
8.3ms single half sine-wave superimposed on
IFSM
rate load (JEDEC methode)
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
VR = VRRM TA = 25^oC
VR = VRRM TA = 125^oC
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
IR
RqJA
CJ
TSTG
-55
TYP.
85
160
MAX.
2.0
UNIT
A
50
A
0.5
10
+150
mA
mA
o_{C / w}
pF
o_C
SYMBOLS
FM220-M
FM230-M
FM240-M
FM250-M
FM260-M
FM280-M
FM2100-M
MARKING
CODE
22
23
24
25
26
28
20
V_RRM ^*1 V_RMS ^*2
(V)
(V)
20
14
30
21
40
28
50
35
60
42
80
56
100
70
V_R ^*3
(V)
20
30
40
50
60
80
100
V_F ^*4
(V)
0.50
0.70
0.85
Operating
temperature
(^o C)
-55 to +125
-55 to +150
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage