FM0206 Datasheet, PDF (1/2 Pages) Formosa MS – Chip Schottky Barrier Diodes - Silicon epitaxial planer type

Chip Schottky Barrier Diodes
FM0206
Silicon epitaxial planer type
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
Mechanical data
Case : Molded plastic, JEDEC DO-214AC
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting Position : Any
Weight : 0.0015 ounce, 0.05 gram
Formosa MS
PATENT PUBLICATION NO. 37116
SMA
0.185(4.8)
0.177(4.4)
0.012(0.3) Typ.
0.110(2.8)
0.094(2.4)
0.165(4.2)
0.150(3.8)
0.040(1.0) Typ.
0.067(1.7)
0.060(1.5)
0.040 (1.0) Typ.
Dimensions in inches and (millimeters)
o
MAXIMUM RATINGS (AT TA=25 C unless otherwise noted)
PARAMETER
CONDITIONS
Forward rectified current
See Fig.1
Forward surge current
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V_R = V_RRM T_A = 25^oC
V_R = V_RRM T_A = 125^oC
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
Symbol
I_O
MIN.
TYP.
MAX.
0.2
UNIT
A
I_FSM
15
A
5
uA
I_R
20
uA
Rq_JA
88
o_{C / w}
C_J
120
pF
T_STG
-55
+150
o_C
SYMBOLS
FM0206
MARKING
CODE
SK14
V_RRM ^*1
(V)
6.0
V_RMS ^*2
(V)
4.2
V_R ^*3
(V)
6.0
V_F ^*4
(V)
0.50
Operating
temperature
(^oC)
-55 to +125
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage