BZT55C Datasheet, PDF (1/3 Pages) TEMIC Semiconductors – Silicon Epitaxial Planar Z-Diodes

Formosa MS
BZT52C2V0S - BZT52C39S
SURFACE MOUNT ZENER DIODE
SPICE MODELS: BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S
BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S
BZT52C18S BZT52C20S BZT52C22S BZT52C24S BZT52C27S BZT52C30S BZT523C33S BZT52C36S BZT52C39S
Features
· Planar Die Construction
· Ultra-Small Surface Mount Package
· Ideally suited for Automated Assembly
Processes
· Also Available in Lead Free Version
Mechanical Data
SOD-323
Dim Min Max
A
2.30 2.70
· Case: SOD-323, Plastic
H
· Case material - UL Flammability Rating
Classification 94V-0
D
G
J
B
1.60 1.80
C
1.20 1.40
D
1.05 Typical
· Moisture sensitivity: Level 1 per J-STD-020A
A
B
· Terminals: Solderable per MIL-STD-202,
Method 208
· Also Available in Lead Free Plating (Matte Tin
C
E
Finish). Please see Ordering Information,
Note 6, on Page 2
E
0.25 0.35
G
0.20 0.40
H
0.10 0.15
J
0.05 Typical
a
0°
8°
· Polarity: Cathode Band
All Dimensions in mm
· Marking: See Sheet 2
· Weight: 0.004 grams (approx.)
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
Characteristic
Forward Voltage (Note 2)
@ I_F = 10mA
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
V_F
P_d
R_qJA
T_j, T_STG
Value
0.9
200
625
-65 to +150
Unit
V
mW
°C/W
°C
Notes: 1. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used in minimize self-heating effect.