LMA421 Datasheet, PDF (3/4 Pages) Filtronic Compound Semiconductors – LOW NOISE PHEMT MMIC

• ASSEMBLY DRAWING
LMA421
LOW NOISE PHEMT MMIC
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Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
Bond on bond or stitch bond acceptable.
Conductor over conductor acceptable. Conductors must not short.
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Revised: 12/05/00
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