LMA208G Datasheet, PDF (3/4 Pages) Filtronic Compound Semiconductors – 2-26GHz PHEMT Amplifier

Filtronic
Solid State
Assembly Diagram
VARIABLE BIAS
2-26GHz PHEMT Amplifier
LMA208G
Notes:
1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond
tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended.
Ultrasonic bonding is not recommended.
2.) The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C. Maximum
time at temperature is 1 minute. Use of forming gas (90% N₂ , 10% H₂ ) for best results.
3.) Bond on bond or stitch bond acceptable.
4.) Conductor over conductor acceptable. Conductors must not short.
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