FMS2011 Datasheet, PDF (3/6 Pages) Filtronic Compound Semiconductors – SP6T GaAs Multi-Band GSM Antenna Switch

Pad and Die Layout:
Preliminary Data Sheet ^1.1
H
K
JP
B
L
C
D
A
Q
F
G
M
E
I
O
N
FMS2011
Pad Number Pad Name
Description
Pin Coordinates (µm)
A
VM
Common Receive Switch
Control Voltage
B
VRX4
RX4 Control Voltage
C
VTX2
TX2 Control Voltage
D
VRX3
RX3 Control Voltage
E
VRX1
RX1 Control Voltage
F
VRX2
RX2 Control Voltage
G
VTX1
TX1 Control Voltage
H
TX2
TX2 RF Output
I
TX1
TX1 RF Output
J
ANT
Antenna
K
RX4
RX4 RF Output
L
RX3
RX3 RF Output
M
RX2
RX2 RF Output
N
RX1
RX1 RF Output
O
GND
Ground 1
P
GND
Ground 1
Q
GND
Ground RXC
99, 576
98, 919
98, 805
98, 689
103, 230
98, 459
105, 347
130, 1037
127, 114
509, 958
779, 1056
779, 856
779, 302
779, 101
605, 141
620, 959
777, 511
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size (µm)
900 x 1150
Die Thickness (µm)
150 µm
Min. Bond Pad
Pitch(µm)
111
Min. Bond pad
opening (µm)
70 x 70
3
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: [phone] Fax: [phone] Email: [e-mail]
Contact Details (USA): Tel: [phone] Fax: [phone] Email: [e-mail]
Website: www.filcs.com