FMS2007 Datasheet, PDF (3/6 Pages) Filtronic Compound Semiconductors – DC-6GHz DPDT Diversity Switch

Pad and Die Layout:
A
B
C
D
E
Preliminary Data Sheet ^2.2
N
M
FMS2007
L
K
J
I
H
Pad Number Pad Name
F
G
Description
A
GND
Ground
B
ANT1
Antenna 1
C
GND
Ground
D
ANT2
Antenna 2
E
GND
Ground
F
V1
RX-Ant1
G
V3
TX-Ant2
H
GND
Ground
I
RX
Receive
J
GND
Ground
K
TX
Transmit
L
GND
Ground
M
V2
RX-Ant2
N
V4
Tx-Ant1
Pin Coordinates
(x µm, y µm)
(142.1 , 709.0)
(142.1 , 581.6)
(142.1 , 448.5)
(142.1 ,327.9)
(142.1 , 201.4)
(349.8 , 88.5)
(522.2 , 88.5)
(769.2 , 201.4)
(769.2 , 327.9)
(769.2 , 448.5)
(769.2 , 581.6)
(769.2 , 709.0)
(522.2 , 807.7)
(349.8 , 807.7)
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size (µm)
897x929
Die Thickness (µm)
150
Min. Bond Pad
Pitch(µm)
127
Min. Bond pad
opening (µm)
80x80
3
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: [phone] Fax: [phone] Email: [e-mail]
Contact Details (USA): Tel: [phone] Fax: [phone] Email: [e-mail]
Website: www.filcs.com