FMS2003 Datasheet, PDF (3/4 Pages) Filtronic Compound Semiconductors – SP4T Reflective pHEMT MMIC Switch

Preliminary Data Sheet^1.0
FMS2003 ES1
SP4T Bonding Configuration
Pad Number
Port
Symbol
Connection on Board
1
RF input port 1
RF 1
RF4
2
DC Control line 1
Vctrl 1
V1
3
Antenna*
ANT
ANT
4
DC Control line 3
Vctrl 3
V2
5
RF input port 3
RF 3
RF5
6
RF input port 2
RF 2
RF1
7
DC Control line 2
Vctrl 2
V4
8
Antenna*
ANT
RF3*
9
DC Control line 4
Vctrl 4
V3
10
RF input port 4
RF 4
RF2
* Either or both of the antenna pads can be bonded. They are electrically the same.
Bonding Pad Layout
561.9 µm (x)
1
694.5 µm (y)
217.78 µm (x)
2
706.75 µm (y)
455 µm (x)
3
706.75 µm (y)
692.22 µm (x)
853.81 µm (x)
4
706.75 µm (y)
5
694.5 µm (y)
145.5 µm (y)
0.00 µm
SP4T F1
561.9 µm (x)
6
217.78 µm (x)
7
133.25 µm (y)
455 µm (x)
8
133.25 µm (y)
692.22 µm (x)
9
133.25 µm (y)
853.81 µm (x)
10
145.5 µm (y)
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd, Heighington Lane Business Park, Newton Aycliffe, Co Durham. DL5 6JW.
Contact Details: Tel: [phone] Fax: [phone] Email: [e-mail] Website: www.filcs.com