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FMS2001 Datasheet, PDF (3/3 Pages) Filtronic Compound Semiconductors – Low Loss SPDT Reflective pHEMT MMIC Switch
Preliminary Data Sheet 1.0
FMS2001 ES1
SPDT Bonding Configuration
Pad Number
Port
1
RF input port1
2
RF input port 2
3
DC Control line 1
4
Antenna
5
DC Control line 2
*RF 3, RF4, RF 5, V3, V4, lines are unused.
Bonding Pad Diagram
52 µm (x)
1
640 µm (y)
Symbol
RF 1
RF 2
Vctrl 1
ANT
Vctrl 2
Connection on Board*
RF1
RF2
V1
ANT
V2
528 µm (x)
3
640 µm (y)
200 µm (y)
0.00 µm
SPDT F1
2
52 µm (x)
4
420 µm (y)
5
200 µm (y)
528 µm (x)
Suggested Application Board Layout
PCB material: FR4
90 deg SMA connector
All transmission lines 50 ohm
90 deg SMA connectors
0603 100pF surface mount ceramic capacitors
90 deg SMA connectors
0603 100pF surface mount ceramic capacitors
90 deg SMA connector
Generic SPDT, 3T and 4T Evaluation Board Layout
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd, Heighington Lane Business Park, Newton Aycliffe, Co Durham. DL5 6JW.
Contact Details: Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filcs.com