FPD10000V Datasheet, PDF (2/3 Pages) Filtronic Compound Semiconductors – 10W POWER PHEMT FOR WIMAX POWER AMPLIFIERS

PRELIMINARY
FPD10000V
10W POWER PHEMT FOR WIMAX POWER AMPLIFIERS
• RECOMMENDED OPERATING BIAS CONDITIONS
Drain-Source Voltage:
From 6V to 12V
Quiescent Current:
From 200mA (Class B) to 1.5A (Class A)
• ABSOLUTE MAXIMUM RATINGS¹
Parameter
Symbol
Test Conditions
Min Max Units
Drain-Source Voltage
V_DS
-3V < V_GS < +0V
15
V
Gate-Source Voltage
V_GS
0V < V_DS < +8V
-3
V
Drain-Source Current
I_DS
For V_DS > 2V
0.5I_DSS mA
Gate Current
RF Input Power²
I_G
Forward or reverse current
P_IN
Under any acceptable bias state
+60/-15 mA
2.25
W
Channel Operating Temperature
T_CH
Under any acceptable bias state
175
ºC
Storage Temperature
T_STG
Non-Operating Storage
-40
150
ºC
Total Power Dissipation
P_TOT
See De-Rating Note below
40
W
Gain Compression
Comp.
Under any bias conditions
5
dB
Simultaneous Combination of Limits³
2 or more Max. Limits
80
%
1_{TAmbient = 22°C unless otherwise noted} 2_{Max. RF Input Limit must be further limited if input VSWR > 2.5:1}
3_{Users should avoid exceeding 80% of 2 or more Limits simultaneously}
Notes:
• Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.
• Thermal Resitivity specification assumes a Au/Sn eutectic die attach onto a Au-plated copper heatsink or rib.
• Power Dissipation defined as: P_TOT ≡ (P_DC + P_IN) – P_OUT, where
P_DC: DC Bias Power
P_IN: RF Input Power
P_OUT: RF Output Power
• Absolute Maximum Power Dissipation to be de-rated as follows above 22°C:
P_TOT= 40W – (0.29W/°C) x T_HS
where T_HS = heatsink or ambient temperature above 22°C
Example: For a 85°C heatsink temperature: P_TOT = 40W – (0.29 x (85 – 22)) = 21.7W
• HANDLING PRECAUTIONS
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. This product has be tested to Class 1A (> 250V but < 500V) using JESD22 A114, Human
Body Model, and to Class A, (< 200V) using JESD22 A115, Machine Model..
• ASSEMBLY INSTRUCTIONS
The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage
temperature should be 280-290°C; maximum time at temperature is one minute. The recommended
wire bond method is thermo-compression wedge bonding with 1.0 mil (0.025 mm) gold wire. Stage
temperature should be 250-260°C.
Phone: [phone]
Fax: [phone]
http:/www.filtronic.co.uk/semis
Revised: 8/5/05
Email: [e-mail]