FMS2028 Datasheet, PDF (2/5 Pages) Filtronic Compound Semiconductors – SP6T GaAs Multi-Band GSM Antenna Switch

ABSOLUTE MAXIMUM RATINGS:
PARAMETER
Max Input
Power
Control
Voltage
Operating
Temp
SYMBOL
Pin
Vctrl
Toper
ABSOLUTE
MAXIMUM
+38dBm
+6V
-40°C to +100°C
Storage Temp
Tstor
-55°C to +150°C
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
PAD LAYOUT:
I
O
H
G
N
F
E
J
D
M
C
L
B
A
K
FMS2028
Preliminary Datasheet v2.1
BONDPADS COORDINATES:
PAD PAD
REF NAME
DESCRIPTION
PIN
COORDINATES
(µM)
A
Tx1
TX1 RF Output
(125.9, 121.4)
B VRx1
Rx1 Control
Voltage
(100.2, 215.9)
C VTx1
Tx1 Control
Voltage
(110.4, 310.5)
D VRx2
Rx2 Control
Voltage
(90.5, 405.1)
E
VM Common Receive
(90.5, 499.7)
Control Voltage
F VRx3
Rx3 Control
Voltage
(90.5, 594.3)
G VTx2
Tx2 Control
Voltage
(107, 688.9)
H VRx4
Rx4 Control
Voltage
(107, 783.5)
I
Tx2
Tx2 RF Output
(125.9, 878.1)
J
ANT
Antenna
(424.9, 499.7)
K
Rx1
Rx1 RF Output
(568.2, 114.8)
L
GND
Ground
(747.4, 282.7)
M
Rx2
RX2 RF Output
(747.4, 380.3)
N
Rx3
RX3 RF Output
(747.4, 681.2)
O
Rx4
RX4 RF Output
(747.4, 882.1)
Note: Co-ordinates are referenced from the bottom
left hand corner of the die to the centre of bond pad
opening
DIE SIZE (µm)
852 x 990
DIE THICKNESS (µm)
MIN. BOND PAD PITCH
(µm)
150
94.6
MIN. BOND PAD OPENING
(µm x µm )
65 x 65
TRUTH TABLE:
VM
VRX4
VRX3
VRX2
Low
Low
Low
Low
Low
Low
Low
Low
High
Low
Low
Low
High
Low
Low
High
High
Low
High
Low
High
High
Low
Low
Note: High: 2.7V ± 0.2V; Low: 0V ± 0.2V
VRX1
Low
Low
High
Low
Low
Low
VTX2
Low
High
Low
Low
Low
Low
VTX1
High
Low
Low
Low
Low
Low
ON PATH
ANT-TX1
ANT-TX2
ANT-RX1
ANT-RX2
ANT-RX3
ANT-RX4
Tel: [phone]
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: [phone]
Email: [e-mail]
Website: www.filtronic.com