FMS2027_1 Datasheet, PDF (2/5 Pages) Filtronic Compound Semiconductors – DC-20 GHZ MMIC SPDT ABSORPTIVE SWITCH

ABSOLUTE MAXIMUM RATINGS:
PARAMETER
Max Input
Power
SYMBOL
Pin
ABSOLUTE
MAXIMUM
+38dBm
Control
Voltage
Operating
Temp
Vctrl
Toper
–
-40°C to +85°C
Storage Temp
Tstor
-55°C to +150°C
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
PAD LAYOUT:
B
A
A
RFIN
B
RFO1 _{A B A} RFO2
Note:
1_{Co-ordinates are referenced from the bottom left}
hand corner of the die to the centre of bond pad
opening
2_{Only one control line A and one control line B}
require connection
TRUTH TABLE:
FMS2027
Pre-Production Datasheet v3.0
CONTROL LINE
RF PATH
A
B RFIN-RFO1
-5V
0V
ON
0V
-5V
OFF
Note: -5V ± 0.2V; 0V ± 0.2V
RFIN-RFO2
OFF
ON
PAD
NAME
RFIN
RFO1
RFO2
A
A
A
A
B
B
B
DESCRIPTION
RFIN
RFOUT1
RFOUT2
VA1
VA2
VA3
VA4
VB1
VB2
VB3
DIE SIZE (µm)
1336 x 934
DIE THICKNESS
(µm)
100
MIN. BOND PAD PITCH
(µm)
150
MIN. BOND PAD OPENING
(µm x µm )
94 x 94
Tel: [phone]
2
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: [phone]
Email: [e-mail]
Website: www.filtronic.com