FMS2027 Datasheet, PDF (2/4 Pages) Filtronic Compound Semiconductors – DC-20 GHZ MMIC SPDT NON-REFLECTIVE SWITCH

ABSOLUTE MAXIMUM RATINGS:
PARAMETER SYMBOL
Max Input Power
Pin
ABSOLUTE
MAXIMUM
+38dBm
Control Voltage
Vctrl
+XV
Operating Temp
Toper
-40°C to +100°C
Storage Temp
Tstor
-55°C to +150°C
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
PAD LAYOUT:
RFIN
B
A
RFO1
AB A
A
B
RFO2
Note:
1_{Co-ordinates are referenced from the bottom left}
hand corner of the die to the centre of bond pad
opening
2_{Only one control line A and one control line B}
require connection
TRUTH TABLE:
FMS2027
Preliminary Datasheet v2.2
CONTROL LINE
RF PATH
A
B RFIN-RFO1
-5V
0V
ON
0V
-5V
OFF
Note: -5V ± 0.2V; 0V ± 0.2V
RFIN-RFO2
OFF
ON
PAD
NAME
RFIN
RFO1
RFO2
A
A
A
A
B
B
B
DESCRIPTION
RFIN
RFOUT1
RFOUT2
VA1
VA2
VA3
VA4
VB1
VB2
VB3
PIN
COORDINATES
(µm)
(653, 776)
(125, 333)
(125, 776)
(125, 626)
(504, 176)
(807, 176)
(1183, 776)
(125, 776)
(654, 176)
(1183, 626)
DIE SIZE (µm)
1910 x 1110 (pizza mask)
1300 x 800 (production mask)
DIE THICKNESS
(µm)
100
MIN. BOND PAD PITCH
(µm)
150
MIN. BOND PAD OPENING
(µm x µm )
96 x 96
Tel: [phone]
2
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: [phone]
Email: [e-mail]
Website: www.filtronic.com