FMS2024_1 Datasheet, PDF (2/5 Pages) Filtronic Compound Semiconductors – DC-20 GHZ MMIC SPDT REFLECTIVE SWITCH

ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL
ABSOLUTE
MAXIMUM
Max Input Power
Pin
+38dBm
Control Voltage
Vctrl
+1/-10V
Operating Temp
Toper
-40°C to +100°C
Storage Temp
Tstor
-55°C to +150°C
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
PAD LAYOUT
FMS2024
Production Datasheet v3.0
PAD
NAME
DESCRIPTION
RFIN
RFO1
RFO2
V1
V2
V3
V4
V11
V22
V33
V44
RFIN
RFOUT1
RFOUT2
V1
V2
V3
V4
V11
V22
V33
V44
PIN
COORDINATES
(µm)
116,1055
1408,1929
1408,181
645, 1929
395, 1929
395, 181
645, 181
1753,1608
1753,1408
1753,702
1753,502
Note: Co-ordinates are referenced from the bottom
left hand corner of the die to the centre of bond pad
opening
DIE SIZE (µm)
1910 x 2110
DIE THICKNESS (µm)
100
MIN. BOND PAD PITCH
(µm)
150
MIN. BOND PAD OPENING
(µm x µm )
116 x 116
TRUTH TABLE
V1 OR V11
-5V
0V
0V
CONTROL LINES
V2 OR V22
0V
-5V
-5V
V3 OR V33
-5V
0V
-5V
V4 OR V44
0V
-5V
0V
RF PATH
RFIN-RFO1
On
Off
Off
RFIN-RFO2
Off
On
Off
Note 1: -5V ± 0.2V; 0V ± 0.2V
Note 2: V11, V22, V33 and V44 are alternative control lines to V1, V2, V3 and V4 respectively
Tel: [phone]
2
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: [phone]
Email: [e-mail]
Website: www.filtronic.com