FMS2024 Datasheet, PDF (2/4 Pages) Filtronic Compound Semiconductors – DC-20 GHZ MMIC SPDT REFLECTIVE SWITCH

ABSOLUTE MAXIMUM RATINGS:
PARAMETER
Max Input Power
SYMBOL
Pin
ABSOLUTE
MAXIMUM
+38dBm
Control Voltage
Vctrl
+XV
Operating Temp
Toper
-40°C to +100°C
Storage Temp
Tstor
-55°C to +150°C
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
PAD LAYOUT:
FMS2024
Preliminary Datasheet v2.2
PAD
NAME
DESCRIPTION
PIN
COORDINATES (µm)
RFIN
RFIN
116,1055
RFO1
RFOUT1
1408,1929
RFO2
RFOUT2
1408,181
V1
V1
645, 1929
V2
V2
395, 1929
V3
V3
395, 181
V4
V4
645, 181
V11
V11
1753,1608
V22
V22
1753,1408
V33
V33
1753,702
V44
V44
1753,502
Note: Co-ordinates are referenced from the bottom
left hand corner of the die to the centre of bond pad
opening
DIE SIZE (µm)
1910 x 2110
DIE THICKNESS (µm)
100
MIN. BOND PAD PITCH
(µm)
150
MIN. BOND PAD OPENING
(µm x µm )
116 x 116
TRUTH TABLE:
CONTROL LINES
RF PATH
V1 OR V11 V2 OR V22 V3 OR V33 V4 OR V44 RFIN-RFO1 RFIN-RFO2
-5V
0V
-5V
0V
On
Off
0V
-5V
0V
-5V
Off
On
0V
-5V
-5V
0V
Off
Off
Note: -5V ± 0.2V; 0V ± 0.2V
Note: V11, V22, V33 and V44 are alternative control lines to V1, V2, V3 and V4 respectively
Tel: [phone]
2
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: [phone]
Email: [e-mail]
Website: www.filtronic.com