FMS2023 Datasheet, PDF (2/4 Pages) Filtronic Compound Semiconductors – DC-20 GHZ MMIC LOW LOSS SPST ABSORPTIVE SWITCH

ABSOLUTE MAXIMUM RATINGS:
PARAMETER
Max Input Power
SYMBOL
Pin
ABSOLUTE
MAXIMUM
+38dBm
Operating Temp
Toper
-40°C to +100°C
Storage Temp
Tstor
-55°C to +150°C
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
PAD LAYOUT:
TRUTH TABLE:
FMS2023
Preliminary Datasheet v2.2
CONTROL LINE
RF PATH
V1
V2
RFIN-RFO
-5V
0V
0V
-5V
On (Low Loss)
Off (Isolation)
Note: -5V ± 0.2V; 0V ± 0.2V
PAD
NAME
DESCRIPTION
RFIN
RFO
V1
V2
RFIN
RFOUT
V1
V2
PIN
COORDINATES
(µm)
141,587
1789,587
901,161
1101,161
Note: Co-ordinates are referenced from the bottom
left hand corner of the die to the centre of bond pad
opening
DIE SIZE (µm)
1910 x 1110
DIE THICKNESS (µm)
MIN. BOND PAD PITCH
(µm)
100
150
MIN. BOND PAD OPENING
(µm x µm )
116 x 116
Tel: [phone]
2
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: [phone]
Email: [e-mail]
Website: www.filtronic.com