FMS2022 Datasheet, PDF (2/4 Pages) Filtronic Compound Semiconductors – DC-4 GHz MMIC SP4T Absorptive Switch

Advanced Product Information ^1.1
FMS2022
Truth Table:
Control Lines
RF Path
A1 B1 A2 B2 A3 B3 A4 B4 IN-OUT1 IN-OUT2 IN-OUT3 IN-OUT4
-5V 0V 0V -5V 0V -5V 0V -5V
ON
OFF
OFF
OFF
0V -5V -5V 0V 0V -5V 0V -5V
OFF
ON
OFF
OFF
0V -5V 0V -5V -5V 0V 0V -5V
OFF
OFF
ON
OFF
0V -5V 0V -5V 0V -5V -5V 0V
OFF
OFF
OFF
ON
Note: -5V ± 0.5V, 0V+0.5V
Pad Layout:
OUT1
GND3
IN
GND4
OUT4
GND1 OUT2
GND2 OUT3
Pad
Description Pin Coordinates
Reference
A2
(µm)
IN
RFIN
142,657.5
B2
OUT1
OUT2
A1
OUT3
RFOUT1
RFOUT2
RFOUT3
142,1174
675,1174
675,141
B1
OUT4
A1
A4
B1
RFOUT4
A1
B1
142,141
805,878
805,731
A2
A2
B4
B2
B2
A3
A3
A3
805,1172
805,1025
805,290
B3
B3
B3
A4
A4
805,143
805,584
B4
B4
805,437
GND1
GND
504,1174
GND2
GND
504,141
GND3
GND
142,869
GND4
GND
142,446
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size
( µm x µm )
950 x 1320
Die Thickness (µm)
150
Min. Bond Pad
Pitch(µm)
130
Min. Bond pad
Opening (µm xµm )
94 x 94
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: [phone] Fax: [phone] Email: [e-mail]
Contact Details (USA): Tel: [phone] Fax: [phone] Email: [e-mail]
Website: www.filtronic.co.uk/semis