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FMS2021 Datasheet, PDF (2/4 Pages) Filtronic Compound Semiconductors – DC- 6 GHz SPDT WLAN GaAs Low Loss Switch
Advanced Product Information 1.1
FMS2021
Truth Table:
State Vctrl1 Vctrl2 Vctrl3
1
HIGH
LOW
LOW
2
LOW
HIGH
LOW
3
LOW
LOW
HIGH
4
LOW
LOW
LOW
5
LOW
HIGH
LOW
6
HIGH
LOW
HIGH
Note: ‘High’ = +2.4V to +3.3V
‘Low’ = 0V to +0.2V
Pad and Die Layout:
V4
V2
GND1
ANT1
TX
ANT2
RX
GND2
V1
V3
Vctrl4
LOW
LOW
LOW
HIGH
HIGH
LOW
ON PATH(S)
ANT1-RX
ANT2-RX
ANT2-TX
ANT1-TX
ANT1-TX and ANT2-RX
ANT1-RX and ANT2-TX
Pad
Name
V4
ANT1
ANT2
V1
GND2
V3
RX
TX
V2
GND1
Description
Vctrl4
Antenna 1
Antenna 2
Vcrtl1
Ground 2
Vctrl3
Receive
Transmit
Vctrl2
Ground 1
Pin Coordinates
(x µm, y µm)
134 , 568
134 , 439
134 , 257
134 , 114
355.5 , 114
547 , 114
547 , 257
547 , 439
547 , 568
353 , 568
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size
(µm x µm)
660 x 680
Die Thickness (µm)
150
Min. Bond Pad
Pitch(µm)
129
Min. Bond pad
opening (µm x µm)
80 x 80
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: sales@filcsi.com
Website: www.filcs.com