FMS2018 Datasheet, PDF (2/5 Pages) Filtronic Compound Semiconductors – SP7T GaAs Multi-Band GSM - UMTS Antenna Switch

Advanced Product Information ^1.2
FMS2018
Truth Table:
VTx1
VTx2
VTx3
High
Low
Low
Low
High
Low
Low
Low
High
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Note: ‘High’ = +2.5V to +5V
‘Low’ = 0V to +0.2V
Pad and Die Layout:
VRx1
Low
Low
Low
High
Low
Low
Low
VRx2
Low
Low
Low
Low
High
Low
Low
VRx3
Low
Low
Low
Low
Low
High
Low
VRx4
Low
Low
Low
Low
Low
Low
High
VM
Low
Low
Low
High
High
High
High
Pad Pad
Name
Description
D
A
H
G
S
R
T
F
E
C
M
Q
L
N
B
I J K OP
Note: Co-ordinates are referenced from the
bottom left hand corner of the die to the centre
of the bond pad opening
A
ANT
Antenna
B
Tx1
TX1 RF Output
C
Tx2
TX2 RF Output
D
Tx3
TX3 RF Output
E
Rx1
RX1 RF Output
F
Rx2
RX2 RF Output
G
Rx3
RX3 RF Output
H
Rx4
RX4 RF Output
I
VTX1
TX1 Control Voltage
J
VTX2
TX2 Control Voltage
K
VTX3
TX3 Control Voltage
L
VRX1
RX1 Control Voltage
M
V RX2
RX2 Control Voltage
N
V RX3
RX3 Control Voltage
O
V RX4
RX4 Control Voltage
P
VRXC
Common Receive Switch
Control Voltage
Q
GND T1
Ground 1
R
GND T2
Ground 2
S
GND T3
Ground 3
T
GND Rc
Ground 4
ON PATH
ANT-TX1
ANT-TX2
ANT-TX3
ANT-RX1
ANT-RX2
ANT-RX3
ANT-RX4
Pin
Coordinates
(µm)
698, 1167
183, 110
182, 498
184, 1147
1066, 536
1063, 663
1063, 993
1066, 1126
693, 102
798, 102
903, 102
995, 633
1066, 326
1066, 427
1008, 102
1113, 102
178, 392
184, 764
184, 877
1066, 771
Die Size (µm)
1230 x 1250
Die Thickness (µm)
100
Min. Bond Pad
Pitch(µm)
88
Min. Bond pad
opening (µm)
70 x 70
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: [phone] Fax: [phone] Email: [e-mail]
Contact Details (USA): Tel: [phone] Fax: [phone] Email: [e-mail]
Website: www.filcs.com