FMS2016 Datasheet, PDF (2/4 Pages) Filtronic Compound Semiconductors – SP4T GaAs Multi-Band GSM Antenna Switch

Advanced Product Information ^1.1
FMS2016
Truth Table:
V1
V2
V3
High
Low
Low
Low
High
Low
Low
Low
High
Low
Low
Low
Note: ‘High’ = +2.5V to +5V
‘Low’ = 0V to 0.2V
Pad and Die Layout:
B
A
C
V4
PATH (ON)
Low
Low
Low
High
RF1-ANT
RF2-ANT
RF3-ANT
RF4-ANT
G
F
J
K
L
M
E
D
I
H
Pad Pad Name Description
Pin
Coordinates
A
RF1
B
V1
C
ANT
D
V3
E
RF3
F
RF2
G
V2
H
V4
I
RF4
J
GND1
K
GND2
L
GND3
M
Die Size (µm)
GND4
Die Thickness
(µm)
RF input port 1
DC Control line 1
Antenna
DC Control line 3
RF input port 3
RF input port 2
DC Control line 2
130, 766
237, 815
613, 783
256, 84
136, 128
1124, 765
1025, 816
Note: Co-ordinates
are referenced
from the bottom
left hand corner of
the die to the
centre of the bond
pad opening.
DC Control line 4
985, 81
RF input port 4
1080, 130
Ground 1
111, 508
Ground 2
1121, 504
Ground 3
111, 391
Ground 4
1121, 392
Min. Bond Pad
Pitch(µm)
Min. Bond pad
opening (µm)
1230 x 900
100
96
70 x 70
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: [phone] Fax: [phone] Email: [e-mail]
Contact Details (USA): Tel: [phone] Fax: [phone] Email: [e-mail]
Website: www.filcs.com