FMS2006 Datasheet, PDF (2/4 Pages) Filtronic Compound Semiconductors – DC- 6 GHz SPDT WLAN GaAs Low Loss Switch

Advanced Product Information ^1.1
FMS2006
Truth Table:
V_ctrl1
V_ctrl2
High
Low
Low
High
Note: ‘High’ = +2.4V to +3.3V
‘Low’ = 0V to +0.2V
ANT-RF1
On
Off
ANT-RF2
Off
On
Pad and Die Layout:
VC1
VC2
ANT
RF1
RF2
GND1
GND2
Pad
Reference
ANT
RF1
RF2
VC1
VC2
GND1
GND2
Description
Antenna
Receive
Transmit
Vctrl1 (ANT to RF1 Control)
Vctrl2 (ANT to RF2 Control)
Ground
Ground
Pin Coordinates
(µm)
375,412
108,260
641,260
108,412
641,412
108,108
641,108
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size
( µm x µm )
750 x 510
Die Thickness (µm)
150
Min. Bond Pad
Pitch(µm)
152
Min. Bond pad
Opening (µm xµm )
72 x 72
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: [phone] Fax: [phone] Email: [e-mail]
Contact Details (USA): Tel: [phone] Fax: [phone] Email: [e-mail]
Website: www.filcs.com