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GBU600 Datasheet, PDF (1/2 Pages) First Components International – 6.0Amps Glass Passivated Single Phase Silico n Bridge
Descriptions
6.0Amps Glass Passivated
Single Phase Silicon Bridge
Machamical Dimensions
3.85 + 0.25
18.6 + 0.3
20.4 + 0.3
21.9 + 0.5
1.9 R. TYP.
_ (2PLACES)
~~+
4.4 + 0.2
1.95 + 0.25
10.8 + 0.5
4.2 + 0.2
3.4 + 0.2
16.0 + 0.4
GBU
5.1+ 0.5
Dimensions in millimeters(1mm =0.0394
1.3 + 0.2
Features
Mechanical Data
Ideal for P.C. Board mounting
High surge current capability
This series is UL listed under the Recognized
Component Index, file number E142814
The plastic material used carries Underwriters
Laboratory flammability recognition 94V-0
High temperature soldering guaranteed 265 C /10
seconds at 5 lbs (2.3kg) tension
Case: Molded plastic body
Terminals: Plated leads solderable per MIL-STD-202,
Method 208
Mounting Position:: Any
Weight: 3.8 grams (approx)
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.
For Capacitive load derate current by 20%.
Parameter
Symbol
GBU
600
GBU
601
GBU
602
GBU
604
GBU
606
GBU
608
GBU
610
GBU
612
unit
Maximum repetitive peak reverse voltage
VRRM 50 100 200 400 600 800 1000 1200 V
Maximum RMS bridge input voltage
VRMS 35 70 140 280 420 560 700 840 V
Maximum DC blocking voltage
VDC 50 100 200 400 600 800 1000 1200 V
Maximum average forward rectified
output current at TA=100 C
IF(AV)
6.0
A
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
IFSM
175
Rating for fusing ( t<8.3ms)
I2 t
127
A
A2sec
Typical thermal resistance per element (1)
Operating junction and storage temperature
range
ReJA
TJ,
TSTG
2.2
-55 to + 150
C/W
Max. instantaneous forward voltage drop
VF
1.1
V
per leg at 6.0A
Max. DC reverse current at rated Ta=25C
IR
5.0
uA
Max. DC reverse current at rated Ta=125C
IR
500
uA
Notes: Thermal resistance from Junction to Ambient on PC board mounting