ILC7010 Datasheet, PDF (9/11 Pages) Impala Linear Corporation – 80MA SC70 ULTRA LOW NOISE CMOS RF-LDO REGULATOR

PRODUCT SPECIFICATION
ILC7010/7011
General PCB Layout Considerations
To achieve the full performance of the device, careful circuit
layout and grounding technique must be observed. Establish-
ing a small local ground, to which the GND pin, the output
and bypass capacitors are connected, is recommended, while
the input capacitor should be grounded to the main ground
plane.
The quiet local ground is then routed back to the main
ground plane using feedthrough vias.
In general, the high frequency compensation components
(input, bypass, and output capacitors)should be located as
close to the device as possible.
The proximity of the output capacitor is especially important
to achieve optimal noise compensation from the onboard
error amplifier, especially during high load conditions.
A large copper area in the local ground will provide the heat
sinking discussed above when high power dissipation signif-
icantly increases the temperature of the device.
Component-side copper provides significantly better thermal
performance for this surface-mount device, compared to that
obtained when using only copper planes on the underside.
REV. 1.0.5 3/21/02
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