FODM3010_05 Datasheet, PDF (9/10 Pages) Fairchild Semiconductor – 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Footprint Drawing for PCB Layout
0.024 (0.61)
0.310 (7.87)
0.190 (4.83)
0.060 (1.52)
0.100 (2.54)
Recommended Infrared Reflow Soldering Profile
180°C
(heating)
to 30 s
230°C (peak temperature)
210°C
to 60 s
150 s
90 s
60 s
Time (s)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0
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