H11N1 Datasheet, PDF (8/9 Pages) Fairchild Semiconductor – 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS

6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
Carrier Tape Specifications
4.5 ± 0.20
0.30 ± 0.05
12.0 ± 0.1
2.0 ± 0.05
4.0 ± 0.1
21.0 ± 0.1
Ø1.5 MIN
1.75 ± 0.10
11.5 ± 1.0
9.1 ± 0.20
24.0 ± 0.3
0.1 MAX
10.1 ± 0.20
User Direction of Feed
NOTE
All dimensions are in inches (millimeters)
Reflow Profile (White Package, -M Suffix)
300
230°C, 10–30 s
250
245°C peak
200
150
Time above 183°C, 120–180 sec
100
50
Ramp up = 2–10°C/sec
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)
Ø1.5 ± 0.1/-0
• Peak reflow temperature: 245°C (package surface temperature)
• Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended
© 2003 Fairchild Semiconductor Corporation
Page 8 of 9
4/14/03