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FAN4010_08 Datasheet, PDF (8/9 Pages) Fairchild Semiconductor – High-Side Current Sensor
Mechanical Dimensions
2X
0.05 C
1.45
B
2X
(1)
0.05 C
TOP VIEW
0.55MAX
0.05 C
C
DETAIL A
1.0
1.00
(0.49)
5X
(0.75)
(0.52)
A
1X
PIN 1
0.05
0.00
0.05 C
0.25
0.15
6X
0.10
0.05
CB A
C
(0.30)
6X
RECOMMENED
LAND PATTERN
0.45
0.10
0.00
6X
0.35
0.40
0.30
0.35
0.25
5X
(0.05)
6X
Notes:
0.5
BOTTOM VIEW
0.40
0.30
5X
(0.13)
4X
0.075 X 45
CHAMFER
1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD
2. DIMENSIONS ARE IN MILLIMETERS
3. DRAWING CONFORMS TO ASME Y14.5M-1994
DETAIL A
PIN 1 TERMINAL
MAC06AREVC
Figure 14. 6-Lead MicroPak™ Molded Leadless Package (MLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2007 Fairchild Semiconductor Corporation
FAN4010 Rev. 1.0.5
8
www.fairchildsemi.com