H11N1-M_05 Datasheet, PDF (6/9 Pages) Fairchild Semiconductor – 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS

6-PIN DIP
HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
H11N2-M
H11N3-M
Package Dimensions (Through Hole)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.390 (9.90)
0.260 (6.60) ^{0.332 (8.43)}
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.014 (0.36)
0.010 (0.25)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.320 (8.13)
15°
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.012 (0.30)
0.008 (0.20)
0.100 [2.54]
0.035 (0.88)
0.006 (0.16)
Recommended Pad Layout for
Surface Mount Leadform
0.070 (1.78)
0.060 (1.52)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
© 2005 Fairchild Semiconductor Corporation
Page 6 of 9
6/15/05