H11B815300W Datasheet, PDF (6/9 Pages) Fairchild Semiconductor – 4-Pin Photodarlington Optocoupler

Package Dimensions (Through Hole) Package Dimensions (0.4" Lead Spacing)
0.270 (6.86)
0.250 (6.35)
0.270 (6.86)
0.250 (6.35)
0.190 (4.83)
0.175 (4.45)
0.200 (5.08)
0.115 (2.92)
0.270 (6.86)
0.250 (6.35)
0.154 (3.90)
0.120 (3.05)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
15°
0.300 (7.62)
typ
0.190 (4.83)
0.175 (4.45)
0.200 (5.08)
0.115 (2.92)
0.270 (6.86)
0.250 (6.35)
0.016 (0.40)
0.008 (0.20)
0.154 (3.90)
0.120 (3.05)
0.004 (0.10)
MIN
0.100 (2.54)
TYP
0.400 (10.16)
TYP
0 to 15°
0.016 (0.40)
0.008 (0.20)
Package Dimensions (Surface Mount)
PCB Footprint Layout
0.270 (6.86)
0.250 (6.35)
0.190 (4.83)
0.175 (4.45)
0.300 (7.62)
TYP
0.200 (5.08)
0.115 (2.92)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.100 (2.54)
TYP
0.022 (0.56)
0.016 (0.41)
Lead Coplanarity 0.004 (0.10) MAX
0.315 (8.00)
MIN
0.405 (10.30)
MAX
NOTE
All dimensions are in inches (millimeters)
0.016 (0.40)
0.008 (0.20)
0.295 (7.49)
0.415 (10.54)
0.070 (1.78)
0.060 (1.52)
0.100 (2.54)
0.030 (0.76)
6
www.fairchildsemi.com
H11B815 Rev. 1.0.1