FDMF5822DCCT-ND Datasheet, PDF (6/25 Pages) Fairchild Semiconductor – FDMF5822DC-Smart Power Stage (SPS) Module with Integrated Thermal Warning and Thermal Shutdown

Electrical Characteristics
Typical value is under V_IN=12 V, V_CC=PV_CC=5 V and T_A=T_J=+ 25°C unless otherwise noted. Minimum / Maximum
values are under V_IN=12 V, V_CC=PV_CC=5 V ± 10% and T_J=T_A=-40 ~ 125°C unless otherwise noted.
Symbol
Parameter
Condition
Min. Typ.
GL Going LOW to GH Going HIGH, 10%
t_{D_DEADON} LS Off to HS On Dead Time
GL to 10% GH, PWM Transition LOW to
10
HIGH – See Figure 27
GH Going LOW to GL Going HIGH, 10%
t_{D_DEADOFF} HS Off to LS On Dead Time
GH to 10% GL, PWM Transition HIGH to
5
LOW – See Figure 27
t_{R_GH_20A} GH Rise Time under 20 A I_OUT 10% GH to 90% GH, I_OUT=20 A
9
t_{F_GH_20A} GH Fall Time under 20 A I_OUT
90% GH to 10% GH, I_OUT=20 A
9
t_{R_GL_20A}
GL Rise Time under 20 A I_OUT
10% GL to 90% GL, I_OUT=20 A
9
t_{F_GL_20A} GL Fall Time under 20 A I_OUT
90% GL to 10% GL, I_OUT=20 A
6
t_{PD_TSGHH}
Exiting 3-State Propagation
Delay
PWM (from 3-State) Going HIGH to GH
Going HIGH, V_{IH_PWM} to 10% GH
t_{PD_TSGLH}
Exiting 3-State Propagation
Delay
PWM (from 3-State) Going LOW to GL
Going HIGH, V_{IL_PWM} to 10% GL
High-Side Driver (HDRV, V_CC = PV_CC = 5 V)
R_{SOURCE_GH} Output Impedance, Sourcing
R_{SINK_GH} Output Impedance, Sinking
t_{R_GH}
GH Rise Time
t_{F_GH}
GH Fall Time
Source Current=100 mA
Sink Current=100 mA
10% GH to 90% GH, C_LOAD=1.3 nF
90% GH to 10% GH, C_LOAD=1.3 nF
0.68
0.9
4
3
Weak Low-Side Driver (LDRV2 Only under CCM2 Mode Operation, V_CC = PV_CC = 5 V)
R_{SOURCE_GL} Output Impedance, Sourcing
Source Current=100 mA
I_{SOURCE_GL} Output Sourcing Peak Current GL=2.5 V
R_{SINK_GL} Output Impedance, Sinking
Sink Current=100 mA
I_{SINK_GL}
Output Sinking Peak Current
GL=2.5 V
0.82
2
0.86
2
Low-Side Driver (Paralleled LDRV1 + LDRV2 under CCM1 Mode Operation, V_CC = PV_CC = 5 V)
R_{SOURCE_GL} Output Impedance, Sourcing
Source Current=100 mA
0.47
I_{SOURCE_GL} Output Sourcing Peak Current GL=2.5 V
4
R_{SINK_GL} Output Impedance, Sinking
Sink Current=100 mA
0.29
I_{SINK_GL}
Output Sinking Peak Current
GL=2.5 V
7
t_{R_GL}
GL Rise Time
10% GL to 90% GL, C_LOAD=7.0 nF
9
t_{F_GL}
GL Fall Time
90% GL to 10% GL, C_LOAD=7.0 nF
6
Thermal Warning Flag (125°C)
T_{ACT_THWN_125} Activation Temperature
T_{RST_THWN_125} Reset Temperature
Measured on the driver IC with T_J=T_A
125
110
R_{PLD_THWN} Pull-Down Resistance
I_{PLD_THWN}=1 mA
100
Thermal Shutdown (150°C)
T_{ACT_THDN} Activation Temperature
Measured on the driver IC with T_J=T_A
150
R_{PLD_EN-THDN} Pull-Down Resistance
I_{PLD_EN-THDN}=1 mA
50
Catastrophic Fault (SW Monitor)
V_{SW_MON} SW Monitor Reference Voltage
1.3
t_{D_FAULT}
Propagation Delay to Pull EN /
FAULT# Signal = LOW
20
Max.
45
45
2
Unit
ns
ns
ns
ns
ns
ns
ns
ns
Ω
Ω
ns
ns
Ω
A
Ω
A
Ω
A
Ω
A
ns
ns
°C
°C
Ω
°C
Ω
V
ns
Boot Diode
V_F
Forward-Voltage Drop
I_F=10 mA
V_R
Breakdown Voltage
I_R=1 mA
Note:
6. GH = Gate High, internal gate pin of the high-side MOSFET.
0.4
V
30
V
© 2013 Fairchild Semiconductor Corporation
FDMF5822DC • Rev. 1.0.1
6
www.fairchildsemi.com