FSBM30SH60 Datasheet, PDF (4/16 Pages) Fairchild Semiconductor – SPMTM (Smart Power Module)

Internal Equivalent Circuit and Input/Output Pins
Bottom View
(22) V_{B(W )}
(21) V_{CC(W H)}
(20) IN_{(W H)}
(23) V_{S(W )}
(18) V_B(V)
(17) V_CC(VH)
(16) C OM_(H)
(15) IN_(VH)
(19) V_S(V)
(13) V_B(U)
(12) V_CC(UH)
(11) IN_(UH)
(14) V_S(U)
(10) R_SC
(9) C_SC
(8) C_FOD
(7) V_FO
(6) CO M_(L)
(5) IN_{(W L)}
(4) IN_(VL)
(3) IN_(UL)
(2) CO M_(L)
(1) V_CC(L)
VB
VCC
COM
IN
OUT
VS
VB
VCC
COM
IN
OUT
VS
VB
VCC
COM
IN
OUT
VS
C(SC) ^{OUT(W L)}
C(FOD)
VFO
IN(W L)
O U T (V L)
IN(VL)
IN(UL)
C O M (L )
O U T (U L )
VCC
(32) P
(31) W
(30) V
(29) U
(28) N_W
(27) N_V
(26) N_U
(25) NC
(24) NC
Note:
1) Inverter low-side is composed of three sense-IGBTs including freewheeling diodes for each IGBT and one control IC which has gate driving, current sensing and
protection functions.
2) Inverter power side is composed of four inverter dc-link input pins and three inverter output pins.
3) Inverter high-side is composed of three normal-IGBTs including freewheeling diodes and three drive ICs for each IGBT.
Fig. 3.
©2003 Fairchild Semiconductor Corporation
Rev. E, August 2003