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FSB50450T_07 Datasheet, PDF (4/8 Pages) Fairchild Semiconductor – Smart Power Module (SPM®)
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Recommended Operating Conditions
Symbol
Parameter
Conditions
VPN
VCC
VBS
VIN(ON)
VIN(OFF)
tdead
fPWM
TC
Supply Voltage
Applied between P and N
Control Supply Voltage
High-side Bias Voltage
Input ON Threshold Voltage
Input OFF Threshold Voltage
Applied between VCC and COM
Applied between VB and output(U, V, W)
Applied between IN and COM
Blanking Time for Preventing
Arm-short
VCC=VBS=12 ~ 16.5V, TJ ≤ 150°C
PWM Switching Frequency TJ ≤ 150°C
Case Temperature
TJ ≤ 150°C
Min.
-
12
12
3.0
0
Value
Typ.
300
15
15
-
-
Max.
400
16.5
16.5
VCC
0.6
Units
V
V
V
V
V
1.0
-
-
μs
-
15
-
kHz
-20
-
125
°C
These values depend on PWM
control algorithm
15-V Line
C1
Micom
R1
D1
R5
C5
VCC VB
HIN HO
LIN VS
COM LO
P
VDC
Inverter
Output
C3
N R3
HIN
LIN
Output
Note
0
0
Z
Both FRFET Off
0
1
0
Low-side FRFET On
1
0
VDC
High-side FRFET On
1
1 Forbidden
Shoot-through
10μF
C2
One-Leg Diagram of SPM
Open Open
Z
Same as (0, 0)
* Example of bootstrap paramters:
C1 = C2 = 1μF ceramic capacitor,
R1 = 56Ω,
Note:
(1) It is recommended the bootstrap diode D1 to have soft and fast recovery characteristics with 600-V rating
(2) Parameters for bootsrap circuit elements are dependent on PWM algorithm. For 15 kHz of switching frequency, typical example of parameters is shown above.
(3) RC coupling(R5 and C5) at each input (indicated as dotted lines) may be used to prevent improper input signal due to surge noise. Signal input of SPM® is compatible with
standard CMOS or LSTTL outptus.
(4) Bold lines should be short and thick in PCB pattern to have small stray inductance of circuit, which results in the reduction of surge voltage. Bypass capacitors such as C1, C2
and C3 should have good high-frequency characteristics to absorb high-frequency ripple current.
Figure 2. Recommended CPU Interface and Bootstrap Circuit with Parameters
14.50mm
3.80mm
Note:
MOSFET
Case Temperature(Tc)
Detecting Point
Attach the thermocouple on top of the heatsink-side of SPM® (between SPM® and heatsink if applied) to get the correct temperature measurement.
Figure 3. Case Temperature Measurement
FSB50450T Rev. B
4
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