FAN5665 Datasheet, PDF (3/15 Pages) Fairchild Semiconductor – High-Efficiency, Adaptive Charge Pump 5V Boost

Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
VIN
TJ
TSTG
TL
ESD
Parameter
VIN Pin
EN, VOUT, C1+, C1-, C2+, C2- Pins
Junction Temperature
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
Min.
–0.3
–0.3
–40
–65
3.5
2
Max.
+6.0
+6.0
+150
+150
+260
Unit
V
V
°C
°C
°C
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VIN
IOUT
TA
TJ
CIN, COUT
C1, C2
Parameter
Power Supply Range
Output Current
Operating Ambient Temperature Range
Operating Junction Temperature Range
Input, output capacitor
Bucket capacitor
Min.
2.9
0
–40
–40
Typ.
2.2
0.22
Max.
5.5
30
+85
+125
Unit
V
mA
°C
°C
µF
µF
Thermal Properties
Symbol Parameter
Min.
Typ.
Max.
Units
ΘJA
Junction-to-Ambient Thermal Resistance
170⁽¹⁾
°C/W
Note:
1. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with
four-layer boards in accordance with JESD51- JEDEC standard. Special attention must be paid not to exceed
maximum junction temperature (TJ) at a given ambient temperate (TA).
© 2007 Fairchild Semiconductor Corporation
FAN5665 • Rev. 1.0.0
3
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