FAN5307 Datasheet, PDF (3/13 Pages) Fairchild Semiconductor – High-Efficiency Step-Down DC-DC Converter

Absolute Maximum Ratings
Parameter
V_IN
Voltage on any other pin
Thermal Resistance (Note 1)
Lead Soldering Temperature (10 seconds)
Storage Temperature
Electrostatic Discharge (ESD) Protection
Level (Note 2)
Junction to case, SOT-23
Junction to tab, MLP 3x3
HBM
CDM
Min
-0.3
GND-0.3
-65
4
1
Max
6.5
V_IN + 0.3
130
8
260
150
Unit
V
V
°C/W
°C
°C
kV
Recommended Operating Conditions
Parameter
Supply Voltage Range
Output Voltage Range, Adjustable Version
Output Current
Inductor (Note 3)
Input Capacitor (Note 3)
Output Capacitor (Note 3)
Operating Ambient Temperature Range
Operating Junction Temperature Range
Min
Typ
Max Unit
2.5
5.5
V
0.7
V_IN
V
300
mA
10
µH
4.7
µF
10
µF
-40
+85
°C
-40
+125
°C
Notes:
1. Junction to ambient thermal resistance, θ_JA, is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of vias used, diameter of via used, available copper surface, and attached heat
sink characteristics.
2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
3. Refer to the applications section for further details.
3
www.fairchildsemi.com
FAN5307 Rev. 1.0.4