FDW2501NZ_02 Datasheet, PDF (2/5 Pages) Fairchild Semiconductor – Dual N-Channel 2.5V Specified PowerTrench MOSFET

Electrical Characteristics
Symbol
Parameter
T_A = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
∆BVDSS
∆TJ
IDSS
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
VGS = 0 V, ID = 250 µA
20
ID = 250 µA, Referenced to 25°C
VDS = 16 V, VGS = 0 V
IGSSF
Gate–Body Leakage, Forward
VGS = 12 V, VDS = 0 V
IGSSR
Gate–Body Leakage, Reverse
VGS = –12 V, VDS = 0 V
V
14
mV/°C
1
µA
10
µA
–10 µA
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
∆VGS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = 250 µA
0.6 1.0 1.5
V
ID = 250 µA, Referenced to 25°C
–3
mV/°C
VGS = 4.5 V, ID = 5.5 A
VGS = 2.5 V, ID = 5 A
VGS = 4.5 V, ID = 5.5 A, TJ=125°C
14
18
mΩ
19 25
19 29
VGS = 4.5 V,
VDS = 5 V
30
A
VDS = 5 V,
ID = 5.5 A
30
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 10 V,
f = 1.0 MHz
V GS = 0 V,
1286
pF
305
pF
161
pF
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = 10 V,
VGS = 4.5 V,
ID = 1 A,
RGEN = 6 Ω
VDS = 10 V,
VGS = 4.5 V
ID = 5.5 A,
10 20
ns
14 25
ns
25 40
ns
8
16
ns
12 17
nC
2.6
nC
3
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = 1.0 A (Note 2)
1.0
A
0.7 1.2
V
Notes:
1. R_θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R_θJC is guaranteed by design while R_θCA is determined by the user's board design.
a) R_θJA is 100°C/W (steady state) when mounted on a 1 inch² copper pad on FR-4.
b) R_θJA is 125°C/W (steady state) when mounted on a minimum copper pad on FR-4.
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
3. The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.
FDW2501NZ Rev E1 (W)