FDS6670A_03 Datasheet, PDF (2/5 Pages) Fairchild Semiconductor – Single N-Channel, Logic Level, PowerTrench MOSFET

Electrical Characteristics
Symbol
Parameter
T_A = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
∆BVDSS
∆TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
IGSS
Gate–Body Leakage
VGS = 0 V,
ID = 250 µA
ID = 250 µA, Referenced to 25°C
VDS = 24 V, VGS = 0 V
VDS = 24 V, VGS = 0 V, TJ=55°C
VGS = ±20 V, VDS = 0 V
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
∆VGS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = 250 µA
ID = 250 µA, Referenced to 25°C
VGS = 10 V, ID = 13 A
VGS = 4.5 V, ID = 10.5 A
VGS= 10 V, ID = 13 A, TJ=125°C
VGS = 10 V, VDS = 5 V
VDS = 15 V, ID = 13 A
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
RG
Gate Resistance
VDS = 15 V,
f = 1.0 MHz
V GS = 0 V,
VGS = 15 mV, f = 1.0 MHz
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
VDD = 10 V,
VGS = 10 V,
ID = 1 A,
RGEN = 6 Ω
VDS = 15 V,
VGS = 5 V
ID = 13 A,
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = 2.1 A (Note 2)
trr
Diode Reverse Recovery Time
Qrr
Diode Reverse Recovery Charge ^{IF = 13 A,}
diF/dt = 100 A/µs
30
V
26
mV/°C
1
µA
10
µA
±100 nA
1 1.8
3
V
–5.3
mV/°C
6
8
mΩ
7.2 10
8.5 14
50
A
55
S
2220
pF
535
pF
200
pF
1.7
Ω
11 19
ns
13 24
ns
40 64
ns
13 24
ns
21 30
nC
6
nC
7
nC
2.1
A
0.7 1.2
V
31
nS
21
nC
Notes:
1. R_θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R_θJC is guaranteed by design while R_θCA is determined by the user's board design.
a) 50°C/W when mounted
on a 1in² pad of 2 oz
copper
2 Test: Pulse Width < 300µs, Duty Cycle < 2.0%
b) 125°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
FDS6670A Rev F (W)