FAN5903 Datasheet, PDF (2/3 Pages) Fairchild Semiconductor – Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs

PROVIDED UNDER NDA — PROPRIETARY AND CONFIDENTIAL — DO NOT DISTRIBUTE
Physical Dimensions
0.03 C
2X
E
F
A
B
PIN A1
INDEX AREA
TOP VIEW
D
0.03 C
2X
0.40
A1
0.40
Ø0.20
Cu Pad
Ø0.30
Solder Mask
LAND PATTERN RECOMMENDATION
(NSMD PAD TYPE)
0.05 C
0.06 C
0.539
0.461 E
0.292±0.018
0.208±0.021
C
SEATING PLANE
D
SIDE VIEWS
Ø0.260±0.020
0.40
9X
C
B (Y)±0.018
0.40
A
123
F
(X)±0.018
BOTTOM VIEW
Product
FAN5903UCX
D
1.292 ± 0.030
E
1.342 ± 0.030
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC009AErev1
X
0.271
Y
0.246
Unit
mm
Figure 42. 1.34 x 1.29mm, 9-Bump, 0.4mm-Pitch WLCSP
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FAN5903 • Rev. 1.0.8
18
www.fairchildsemi.com