FAN3100 Datasheet, PDF (2/21 Pages) Fairchild Semiconductor – Single 2A High-Speed, Low-Side Gate Driver

Ordering Information
Part Number Input Threshold
Package
Packing Method
Quantity / Reel
FAN3100CMPX
CMOS
6-Lead 2x2mm MLP
FAN3100CSX
CMOS
5-Pin SOT23
FAN3100TMPX
TTL
6-Lead 2x2mm MLP
FAN3100TSX
TTL
5-Pin SOT23
All packages are lead free per JEDEC: J-STD-020B standard.
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
3000
3000
3000
3000
Package Outlines
IN+ 1
AGND 2
VDD 3
6 IN
5 PGND
4 OUT
Figure 3. 2x2mm 6-Lead MLP (Top View)
Figure 4. SOT23-5 (Top View)
Thermal Characteristics⁽¹⁾
Package
Θ_JL(2) Θ_JT(3) Θ_JA(4) Ψ_JB(5) Ψ_JT(6) Units
6-Lead 2x2mm Molded Leadless Package (MLP)
2.7
133
58
2.8
42
°C/W
SOT23-5
56
99
157
51
5
°C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
3. Theta_JT (ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and
JESD51-7, as appropriate.
5. Psi_JB (ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-6 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOT23-5 package, the board reference is defined as the PCB copper adjacent to pin 2.
6. Psi_JT (ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 4.
© 2007 Fairchild Semiconductor Corporation
FAN3100 • Rev. 1.0.1
2
www.fairchildsemi.com