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FOD3182 Datasheet, PDF (17/23 Pages) Fairchild Semiconductor – 3A Output Current, High Speed MOSFET Gate Driver Optocoupler | |||
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Package Dimensions
Through Hole
9.40â9.91
Pin 1
6.35â6.86
3.68â3.94
5.08
MAX
0.51 MIN
0.41â0.56
2.54 BSC
1.14â1.78
3.05â3.90
(0.78)
0.20â0.40
7.62 TYP
0.4" Lead Spacing (Option T)
9.40â9.91
Pin 1
6.35â6.86
3.68â3.94
5.08
MAX
0.51 MIN
0.41â0.56
2.54 BSC
1.14â1.78
3.05â3.90
(0.78)
15.0° MAX
10.16 TYP
0.20â0.40
Surface Mount â 0.3" Lead Spacing (Option S)
9.40â9.91
Pin 1
(1.78)
(2.54)
6.35â6.86
(7.49)
(10.54)
(1.54)
3.68â3.94
5.08
MAX
1.14â1.78
(0.76)
Recommended Land Pattern
(Option S)
0.20â0.40
0.51 MIN
2.54 BSC
(0.78)
(0.41â0.56)
0.40 MIN
Both sides
8.00 MIN
10.30 MAX
Note:
1. All dimensions are in millimeters.
2. Dimensions are exclusive of burrs, mold fash, and tie bar extrusion.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package speciï¬cations do not expand the terms of Fairchildâs worldwide terms and conditions,
speciï¬cally the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductorâs online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2010 Fairchild Semiconductor Corporation
FOD3182 Rev. 1.0.9
17
www.fairchildsemi.com
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