FHP3350 Datasheet, PDF (17/19 Pages) Fairchild Semiconductor – Triple and Quad Voltage Feedback Amplifiers

Mechanical Dimensions
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package
Number MTC14
6
e
N
–B– 7
2X E/2
1.0 DIA
8
E1 E
1.0
ddd C B A
2X
N/2 TIPS
123
6
1.0
e /2 9
5
(b)
c
c1
b1
SECTION AA
7 –A–
aaa C
–C–
ccc
A2
D^{8 3}
A
b NX A1
bbb M C B A
10
A
A
–H–
GAGE
PLANE
0.25
(02)
(0.20)
R1
R
(03)
L
01
(L1)
SYMBOL
A
A1
A2
L
R
R1
b
b1
c
c1
01
L1
aaa
bbb
ccc
ddd
e
02
03
D
E1
E
e
N
TSSOP-14
MIN
NOM
–
–
0.05
–
0.85
0.90
0.50
0.60
0.09
–
0.09
–
0.19
–
0.19
0.22
0.09
–
0.09
–
0°
–
1.0 REF
0.10
0.10
0.05
0.20
0.65 BSC
12° REF
12° REF
4.90
5.00
4.30
4.40
6.4 BSC
0.65 BSC
14
MAX
1.10
0.15
0.95
0.75
–
–
0.30
0.25
0.20
0.16
8°
5.10
4.50
NOTES:
1 All dimensions are in millimeters (angle in degrees).
2 Dimensioning and tolerancing per ASME Y14.5–1994.
3 Dimensions "D" does not include mold flash, protusions or gate burrs. Mold flash protusions or gate burrs shall not exceed 0.15 per side .
4 Dimension "E1" does not include interlead flash or protusion. Interlead flash or protusion shall not exceed 0.25 per side.
5 Dimension "b" does not include dambar protusion. Allowable dambar protusion shall be 0.08mm total in excess of the "b" dimension at maximum
material condition. Dambar connot be located on the lower radius of the foot. Minimum space between protusion and adjacent lead is 0.07mm
for 0.5mm pitch packages.
6 Terminal numbers are shown for reference only.
7 Datums – A – and – B – to be determined at datum plane – H – .
8 Dimensions "D" and "E1" to be determined at datum plane – H – .
9 This dimensions applies only to variations with an even number of leads per side. For variation with an odd number of leads per side, the "center"
lead must be coincident with the package centerline, Datum A.
10 Cross sections A – A to be determined at 0.10 to 0.25mm from the leadtip.
FHP3350, FHP3450 Rev. 1A
17
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