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FSUSB30_08 Datasheet, PDF (16/18 Pages) Fairchild Semiconductor – Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions
Figure 19. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-
ically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.6
16
www.fairchildsemi.com