HCPL4503M_10 Datasheet, PDF (14/15 Pages) Fairchild Semiconductor – Single-Channel: 6N135M, 6N136M, HCPL4503M Dual-Channel: HCPL2530M, HCPL2531M (Preliminary)

Reflow Profile
260 ^TP
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
240
220 ^TL
200
Tsmax
180
Preheat Area
tL
160
Tsmin
140
ts
120
100
80
60
40
20
0
120
240
Time 25°C to Peak
Time (seconds)
tP
360
Profile Freature
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (t_S) from (Tsmin to Tsmax)
Ramp-up Rate (t_L to t_P)
Liquidous Temperature (T_L)
Time (t_L) Maintained Above (T_L)
Peak Body Package Temperature
Time (t_P) within 5°C of 260°C
Ramp-down Rate (T_P to T_L)
Time 25°C to Peak Temperature
Pb-Free Assembly Profile
150°C
200°C
60–120 seconds
3°C/second max.
217°C
60–150 seconds
260°C +0°C / –5°C
30 seconds
6°C/second max.
8 minutes max.
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
14
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