FSUSB31_08 Datasheet, PDF (13/14 Pages) Fairchild Semiconductor – Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch

Physical Dimensions (Continued)
2X 0.10 C
B
1.4
A
0.725
1.450
0.400
1.20
2X 0.10 ^C
TOP VIEW
0.450
1.250
0.625
0.350 7X
0.250 8X
0.05 C
0.025
0.00
0.55 MAX
0.05 C
SEATING
PLANE
C
DETAIL A
0.40
2
4
0.35
0.25
7X
PIN#1 IDENT
1
5
86
(0.2)
0.15
0.25
8X
0.10
0.05
BOTTOM VIEW
CAB
C
0.10
0.30
45°
0.20
0.10
DETAIL: A
SCALE : 2x
NOTES:
A. DOES NOT CONFORMS TO JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES CONFORMS TO ASME Y14.5M, 1994.
D. DRAWING FILE NAME : UMLP08Arev1
Figure 24. 8-Lead, Ultrathin Molded Leadless Package (UMLP), 1.2 x 1.4mm
For MicroPak™ tape and reel specifications, please visit Fairchild’s website:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-
ically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.8
13
www.fairchildsemi.com