FNB33060T Datasheet, PDF (13/15 Pages) Fairchild Semiconductor – Motion SPMR 3 Series

Gating WH
Gating VH
M ^{Gating UH}
C
U
VTS
Fault
Gating WL
Gating VL
Gating UL
R1
R1
R1
C1 C1 C1
5V line
R3
B
R1
R1
R1
R1
C1
C1 C1 C1
C1
C4
C3 C4
D2
C4
C3 C4
D2
C4
C3 C4
D2
R6
C6
D
C5
15V line
D2
C2
C4
Input Signal for
Short-Circuit Protection
(17) IN(WH)
(18) VDD(H)
(19) VB(W)
(20) VS(W)
(13) IN(VH)
(14) VDD(H)
(15) VB(V)
(16) VS(V)
(9) IN(UH)
(10) VDD(H)
(11) VB(U)
(12) VS(U)
(8) CSC
(7) VTS
(6) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
(2) COM
(1) VDD(L)
IN
VDD
COM
VB
IN
VDD
COM
VB
IN
VDD
COM
VB
OUT
VS
OUT
VS
OUT
VS
CSC
VTS
VFO
IN
IN
IN
COM
VDD
OUT
OUT
OUT
C
W-Phase Current
V-Phase Current
U-Phase Current
P (27)
W (26)
V (25)
U (24)
NW (23)
NV (22)
NU (21)
R5
R5
R5
C5
C5
C5
M
C7
VDC
R4 A
R4
E
Power
GND Line
R4
Control
GND Line
Figure 15. Typical Application Circuit
Note:
14. To avoid malfunction, the wiring of each input should be as short as possible. (less than 2 - 3 cm)
15. V_FO output is open-drain type. This signal line should be pulled up to the positive side of the MCU or control power supply with a resistor that makes I_FO up to 2 mA. Please
refer to Figure 14.
16. Input signal is active-HIGH type. There is a 5 k resistor inside the IC to pull-down each input signal line to GND. RC coupling circuits should be adopted for the prevention
of input signal oscillation. R₁C₁ time constant should be selected in the range 50 ~ 150 ns. (Recommended R₁ = 100 Ω , C₁ = 1 nF)
17. Each wiring pattern inductance of A point should be minimized (Recommend less than 10nH). Use the shunt resistor R₄ of surface mounted (SMD) type to reduce wiring
inductance. To prevent malfunction, wiring of point E should be connected to the terminal of the shunt resistor R₄ as close as possible.
18. To prevent errors of the protection function, the wiring of B, C, and D point should be as short as possible.
19. In the short-circuit protection circuit, please select the R₆C₆ time constant in the range 1.5 ~ 2 s. Do enough evaluaiton on the real system because short-circuit protection
time may vary wiring pattern layout and value of the R₆C₆ time constant.
20. Each capacitor should be mounted as close to the pins of the Motion SPM^® 3 product as possible.
21. To prevent surge destruction, the wiring between the smoothing capacitor C₇ and the P & GND pins should be as short as possible. The use of a high-frequency non-inductive
capacitor of around 0.1 ~ 0.22 F between the P & GND pins is recommended.
22. Relays are used at almost every systems of electrical equipments at industrial application. In these cases, there should be sufficient distance between the CPU and the
relays.
23. The zener diode or transient voltage suppressor should be adopted for the protection of ICs from the surge destruction between each pair of control supply terminals
(Recommanded zener diode is 22 V / 1 W, which has the lower zener impedance characteristic than about 15 Ω ).
24. C₂ of around 7 times larger than bootstrap capacitor C₃ is recommended.
25. Please choose the electrolytic capacitor with good temperature characteristic in C₃. Also, choose 0.1 ~ 0.2 F R-category ceramic capacitors with good temperature and
frequency characteristics in C₄.
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13
FNB33060T Rev. 1.1
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