FAN5362 Datasheet, PDF (12/14 Pages) Fairchild Semiconductor – 3MHz, 500mA / 750mA Synchronous Buck Regulator

Physical Dimensions
F
0.03 C
2X
E
BALL A1
INDEX AREA
A
B
DF
0.03 C
2X
TOP VIEW
0.05 C
0.06 C
0.625
0.547 ^E
A1
0.40
0.40
(Ø0.20)
Cu Pad
(Ø0.30)
Solder Mask
Opening
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.378±0.018
0.208±0.021
C
SEATING PLANE
D
SIDE VIEWS
Ø0.260±0.010
6X
0.40
0.005 C A B
C
B (Y) +/-0.018
0.40
A
12
F
(X) +/-0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASMEY14.5M, 1994.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE TYPICAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: UC006ACrev4.
Figure 26. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP), 2x3 Array, 0.4mm Pitch, 250µm Ball
Product-Specific Dimensions
Product
D
FAN5362UCX
1.310 +/-0.030
E
0.960 +/-0.030
X
0.280
Y
0.255
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Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FAN5362 • Rev. 1.0.1
12
www.fairchildsemi.com