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FAN4274_12 Datasheet, PDF (12/13 Pages) Fairchild Semiconductor – Single and Dual, Ultra-Low Cost, Rail-to-Rail I/O, CMOS Amplifier | |||
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Physical Dimensions
Figure 32. 8-Lead Molded Small Outline Package (MSOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchildâs worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductorâs online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2004 Fairchild Semiconductor Corporation
FAN4174/FAN4274 ⢠Rev. 1.0.8
12
www.fairchildsemi.com
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