SFWI9630 Datasheet, PDF (1/7 Pages) Fairchild Semiconductor – Advanced Power MOSFET

Advanced Power MOSFET
SFW/I9630
FEATURES
Avalanche Rugged Technology
Rugged Gate Oxide Technology
Lower Input Capacitance
Improved Gate Charge
Extended Safe Operating Area
Lower Leakage Current : 10 µA (Max.) @ V_DS = -200V
Low R_DS(ON) : 0.581 Ω (Typ.)
Absolute Maximum Ratings
Symbol
V_DSS
I_D
I_DM
V_GS
E_AS
I_AR
E_AR
dv/dt
P_D
T_J , T_STG
T_L
Characteristic
Drain-to-Source Voltage
Continuous Drain Current (T_C=25^oC)
Continuous Drain Current (T_C=100^oC)
Drain Current-Pulsed
O¹
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
O²
Avalanche Current
O¹
Repetitive Avalanche Energy
O¹
Peak Diode Recovery dv/dt
O³
Total Power Dissipation (T_A=25^oC) ^*
Total Power Dissipation (T_C=25^oC)
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8 “ from case for 5-seconds
BV_DSS = -200 V
R_DS(on) = 0.8 Ω
I_D = -6.5 A
D²-PAK I²-PAK
2
1
1
2
3
3
1. Gate 2. Drain 3. Source
Value
-200
-6.5
-4.0
-26
+_{_ 30}
563
-6.5
7.0
-5.0
3.1
70
0.56
- 55 to +150
300
Units
V
A
A
V
mJ
A
mJ
V/ns
W
W
W/^oC
o_C
Thermal Resistance
Symbol
Characteristic
Typ.
R_θJC
R_θJA
R_θJA
Junction-to-Case
--
Junction-to-Ambient *
--
Junction-to-Ambient
--
* When mounted on the minimum pad size recommended (PCB Mount).
Max.
1.79
40
62.5
Units
o_C/W
Rev. B
©1999 Fairchild Semiconductor Corporation