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SFR9214 Datasheet, PDF (1/7 Pages) Fairchild Semiconductor – Advanced Power MOSFET
Advanced Power MOSFET
SFR/U9214
FEATURES
ν Avalanche Rugged Technology
ν Rugged Gate Oxide Technology
ν Lower Input Capacitance
ν Improved Gate Charge
ν Extended Safe Operating Area
ν Lower Leakage Current : 10 µA (Max.) @ VDS = -250V
ν Lower RDS(ON) : 3.15 Ω (Typ.)
BVDSS = -250 V
RDS(on) = 4.0 Ω
ID = -1.53 A
D-PAK I-PAK
2
1
1
2
3
3
Absolute Maximum Ratings
Symbol
VDSS
ID
IDM
VGS
EAS
IAR
EAR
dv/dt
PD
TJ , TSTG
TL
Characteristic
Drain-to-Source Voltage
Continuous Drain Current (TC=25oC)
Continuous Drain Current (TC=100oC)
Drain Current-Pulsed
O1
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
O2
Avalanche Current
O1
Repetitive Avalanche Energy
O1
Peak Diode Recovery dv/dt
O3
Total Power Dissipation (TA=25oC) *
Total Power Dissipation (TC=25oC)
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8" from case for 5-seconds
1. Gate 2. Drain 3. Source
Value
-250
-1.53
-0.97
-6.1
+_ 30
110
-1.53
1.9
-4.8
2.5
19
0.15
- 55 to +150
300
Units
V
A
A
V
mJ
A
mJ
V/ns
W
W
W/oC
oC
Thermal Resistance
Symbol
Characteristic
Typ.
RθJC
Junction-to-Case
--
RθJA
Junction-to-Ambient *
--
RθJA
Junction-to-Ambient
--
* When mounted on the minimum pad size recommended (PCB Mount).
Max.
6.58
50
110
Units
oC/W
Rev. B1
2001 Fairchild Semiconductor Corporation