RMPA2266 Datasheet, PDF (1/7 Pages) Fairchild Semiconductor – WCDMA Band I Power Amplifier Module

PRELIMINARY
RMPA2266 i-Lo™
WCDMA Band I Power Amplifier Module
April 2007
tm
Features
■ 40% WCDMA efficiency at +28dBm Pout
■ 20% WCDMA efficiency (58mA total current) at
+16dBm Pout
■ Low quiescent current (Iccq): 25mA in low-power
mode
■ Meets UMTS/WCDMA performance requirements
■ Meets HSDPA performance requirements
■ Single positive-supply operation with low power and
shutdown modes
– 3.4V typical Vcc operation
– Low Vref (2.85V) compatible with advanced handset
chipsets
■ Compact Lead-free compliant LCC package –
(4.0 x 4.0 x 1.0mm nominal)
■ Industry standard pinout
■ Internally matched to 50Ω and DC blocked RF
input/output
General Description
The RMPA2266 Power Amplifier Module (PAM) is
Fairchild’s latest innovation in 50Ω matched, surface
mount modules targeting UMTS/WCDMA/HSDPA
applications. Answering the call for ultra-low DC power
consumption and extended battery life in portable
electronics, the RMPA2266 uses novel proprietary
circuitry to dramatically reduce amplifier current at low to
medium RF output power levels (< +16dBm), where the
handset most often operates. A simple two-state Vmode
control is all that is needed to reduce operating current
by more than 60% at 16dBm output power, and
quiescent current (Iccq) by as much as 70% compared
to traditional power-saving methods. No additional
circuitry, such as DC-to-DC converters, are required to
achieve this remarkable improvement in amplifier
efficiency. Further, the 4 x 4 x 1.0mm LCC package is
pin-compatible and a drop-in replacement for last
generation 4 x 4mm PAMs widely used today, minimizing
the design time to apply this performance-enhancing
technology. The multi-stage GaAs Microwave Monolithic
Integrated Circuit (MMIC) is manufactured using
Fairchild RF’s InGaP Heterojunction Bipolar Transistor
(HBT) process.
Functional Block Diagram
(Top View)
Vcc1 1
RF IN 2
GND 3
Vmode 4
Vref 5
MMIC
INPUT
MATCH
BIAS/MODE SWITCH
10 Vcc2
OUTPUT
MATCH
9 GND
8 RF OUT
7 GND
6 GND
11 (paddle ground on package bottom)
©2007 Fairchild Semiconductor Corporation
RMPA2266 i-Lo™ Rev. D
www.fairchildsemi.com