RMPA0966_07 Datasheet, PDF (1/7 Pages) Fairchild Semiconductor – WCDMA Band V Power Amplifier Module

PRELIMINARY
RMPA0966 i-Lo™
WCDMA Band V Power Amplifier Module
April 2007
tm
Features
■ 42% CDMA/WCDMA efficiency at +28dBm Pout
■ 21% CDMA/WCDMA efficiency (56mA total current) at
+16dBm Pout
■ Meets HSDPA performance requirements
■ 50% AMPS mode efficiency at +31dBm Pout
■ Low quiescent current (Iccq): 15mA in low-power
mode
■ Single positive-supply operation with low power and
shutdown modes
• 3.4V typical Vcc operation
• Low Vref (2.85V) compatible with advanced handset
chipsets
■ Compact Lead-free compliant LCC package –
(4.0 X 4.0 x 1.0 mm nominal)
■ Industry standard pinout
■ Internally matched to 50 Ohms and DC blocked RF
input/output
General Description
The RMPA0966 Power Amplifier Module (PAM) is
Fairchild’s latest innovation in 50Ω matched, surface mount
modules targeting Cellular CDMA/WCDMA/HSDPA,
AMPS and Wireless Local Loop (WLL) applications.
Answering the call for ultra-low DC power consumption
and extended battery life in portable electronics, the
RMPA0966 uses novel proprietary circuitry to dramati-
cally reduce amplifier current at low to medium RF out-
put power levels (<+16 dBm), where the handset most
often operates. A simple two-state Vmode control is all
that is needed to reduce operating current by more than
60% at 16 dBm output power, and quiescent current
(Iccq) by as much as 70% compared to traditional
power-saving methods. No additional circuitry, such as
DC-to-DC converters, are required to achieve this
remarkable improvement in amplifier efficiency. Further,
the 4x4x1.0mm LCC package is pin-compatible and a
drop-in replacement for last generation 4x4mm PAMs
widely used today, minimizing the design time to apply
this performance-enhancing technology. The multi-stage
GaAs Microwave Monolithic Integrated Circuit (MMIC) is
manufactured using Fairchild RF’s InGaP Heterojunction
Bipolar Transistor (HBT) process.
Functional Block Diagram
Vref 1
MMIC
Vmode 2
(Top View)
BIAS/MODE SWITCH
GND ³
RF IN ⁴
Vcc1 5
INPUT
MATCH
10 GND
9 GND
OUTPUT
MATCH
8 RF OUT
7 GND
6 Vcc2
11 (paddle ground on package bottom)
©2007 Fairchild Semiconductor Corporation
RMPA0966 i-Lo™ Rev. B
www.fairchildsemi.com